F2008-05-017
Systemintergation of Electronics in Decentraliced Actors of the Powertrain System
In the course of the ACEA CO2 self commitment, the automobile industry has initiated to reducing the CO2 emission to 140g/km until 2008. Due to this fact many subsystems in the powertrain will be tailord to suit the market need of lower fuel consumption and emission reduction. It is observed that there are a lot of activities to adapted mechanically operated systems to electrically operated actuators in order to operate them only when their functionality is needed. The functionality of the on demand automotive applications needs power electronics combined with logic, control and communications circuits and components in one module packaging for high temperature exposure. The requirements for fast temperature and power cycling of the power and logic circuits and their packaging rises up to 210°C for 100-200 times. Main interest of reliability is a tight TCE mismatch for the whole packging compound. Recently, at AB Mikroelektronik developed thickfilm copper and silber hybrid technologies allows a thickness of conductor tracks of about 100µm, specially used for the power eelctronics part of the electronic system. This means that a current carrying capability of 80-100A by means of advanced hybrid technologies can be established. The logic, control and communication circuit is realised on the same substrate than the power electronics, but with minimized dimensions of the pitch resolution and conductor thickness (12-15µm). The combination of the power and the control electronics on one substrate with adequate pattern structures give an opportunity for high density electronic systems for integrated, automotive actor electronics. Due to the fact that in such applications always prohibitive problems concerning the power dissipation of the power electronics and highly temperature sensitive µC behaviour occures, AB Mikroelektronik is going to have reserach activities in the area of screen printed dielectric material on metallic heatsinks. The so called "Anotherm Plus technology" will realize the possibility to to the circuit patterning of the electronic circuit directly on heatsinks.
Poster presentation: Electronics